上海思将企业管理咨询有限公司

1、负责2.4G射频通讯芯片射频设计(包括Bluetooth，Zigbee，WIFI等)。 2、参与芯片设计到量产的全部环节，如电路设计、版图仿真验证、样品测试、量产调试等，实现芯片如期交付，并撰写相关文档。

As the Field Application Manager for Greater China, you will serve as the technical leadership backbone for our regional engineering operations. You will lead a high-performing team of Field Application Engineers (FAEs) across China and Taiwan, ensuring seamless technical support throughout the sales process and acting as a critical bridge between our regional customers and Global Business Units (BUs), manufacturing, and development. More specifically, you will: - Lead Field Technical Support: Manage and mentor the FAE team to resolve customer technical problems during project development. You will oversee the delivery of system solution selling and ensure all technical documentation is prioritized and ready for market workshops and seminars. - Drive Regional Business Growth: Partner with Account Managers to set goals for increasing the new project pipeline. You will track milestones from design-in to design-win and collaborate with Marketing and BUs to promote products from a technical perspective. - Optimize Channel Management: Provide technical training to distributors to improve their competency and work closely with Distribution Sales Managers (DSMs) to track projects. You will also proposal and manage Independent Design Houses (IDHs) for relevant product applications. - Act as a Bridge between Field & other teams: Collaborate with Business Units/Sales and Marketing on resource deployment for the Greater China market. You will analyze market trends and competitive solutions to influence new product definitions based on regional customer needs. - Execute Team Development: Set clear goals and expectations for the FAE team, driving resource allocation in coordination with the Regional Sales Manager. You will focus on talent development plans to elevate the team’s technical competency and soft skills. Your profile - A professional background in technical leadership or senior engineering operations, such as a Lead FAE or Application Engineering Manager role. - Proven expertise in leading and managing engineering teams to provide post-development support and system-level solutions. - Strong business acumen with the ability to analyze industry trends, market forces, and competitive landscapes to drive design-win outcomes. - Exceptional organizational excellence and the ability to prioritize resource allocations across multiple high-stakes projects in China and Taiwan. - Effective communication skills in English and Mandarin, with the ability to act as a professional interface between regional field teams and global manufacturing/development hubs. - Rigorous attention to detail regarding project milestones, technical documentation, and regional market strategy.

"工作经验：8年及以上（35岁以内） 学历要求：硕士及以上 目标院校：211及以上 专业方向：微电子/电子信息工程/自动化/计算机等相关专业 公司背景：国内主流芯片设计公司、科研院所、科技硬件产品类公司 工作背景： 1、 精通主流数字后端EDA，包括但不限于Innovus、virtuoso、PT、Redhawk、calibre等； 2、 掌握数字后端相关理论知识，包括但不限于器件结构、器件参数、逻辑电路、收敛标准、时序约束、时序检查、信号完整性、电源完整性、AOCV、竞争冒险、天线等； 3、 具备数字后端相关文件编写或优化能力，包括但不限于tcl、lef/lib、tech file、upf等； 4、 具备12nm/28nm及以上工艺节点物理实现及成功流片经验(至少1次12nm设计经验)； 5、 具备CPU等关键模块物理实现及成功流片经验; 6、 具备低功耗策略物理实现及成功流片经验； 7、 具备ASIC、SOC、SOPC类芯片总图物理实现及成功流片经验； 8、 熟悉2.5D/3D封装技术者优先； 9、 熟悉Tapeout到回片测试支持能力，包括但不限于测试结果分析、良率提升、量产调试者优先； 10、具备良好的英文阅读能力，能阅读各种SPEC； 11、主动学习能力强，责任心强，善于沟通，注重团队协作。 入职之后岗位职责： 担任数字芯片版图设计工作，含布局布线、功耗分析、物理验证及测试支持等，具体如下： 1、与数字前端建立有效沟通，建立项目sign-off标准； 2、使用主流EDA工具完成数字芯片top或模块从Netlist到GDSII的物理实现工作； 3、完成sign-off收敛和数据固化，含时序收敛、功耗收敛、SI收敛、数据整合、PV收敛； 4、完成跨EDA组件流程的开发、完善工作； 5、协助可靠性设计、封装设计、全定制版图设计、库文件处理等工作； 6、撰写项目版图相关研发文档。"

1.负责数字集成电路（如CPU、GPU、AI芯片等）的前端功能验证，包括验证计划制定、测试用例编写及验证环境搭建。 2.使用SystemVerilog、UVM等语言构建验证平台，开发自动化测试脚本，确保芯片功能符合设计规范。 3.参与芯片设计需求分析与评审，从验证角度提供可测试性建议，协助提升设计质量。 4.执行验证流程，记录并分析测试结果，定位功能缺陷，与设计团队协作推动问题解决。 5.维护验证环境及相关文档，优化验证效率，参与验证方法学的改进与落地。